The Draak and Ebisu boards support an optional LVDS panel. One
compatible panel is the Mitsubishi AA104XD12. Add a corresponding DT
overlay.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Link: https://lore.kernel.org/r/20211229193135.28767-4-laurent.pinchart+renesas@ideasonboard.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
The Salvator-X and Salvator-XS boards support an optional LVDS panel.
One compatible panel is the Mitsubishi AA104XD12. Add a corresponding DT
overlay.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Link: https://lore.kernel.org/r/20211229193135.28767-3-laurent.pinchart+renesas@ideasonboard.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
The Mitsubishi AA1024XD12 panel can be used for R-Car Gen2 and Gen3
boards as an optional external panel. It is described in the
arm/boot/dts/r8a77xx-aa104xd12-panel.dtsi file as a direct child of the
DT root node. This allows including r8a77xx-aa104xd12-panel.dtsi in
board device trees, with other minor modifications, to enable the panel.
This is however not how external components should be modelled. Instead
of modifying the board device tree to enable the panel, it should be
compiled as a DT overlay, to be loaded by the boot loader.
Prepare the r8a77xx-aa104xd12-panel.dtsi file for this usage by
declaring a panel node only, without hardcoding its path. Overlay
sources can then include r8a77xx-aa104xd12-panel.dtsi where appropriate.
This change doesn't cause any regression as r8a77xx-aa104xd12-panel.dtsi
is currently unused. As overlay support for this panel has only been
tested with Gen3 hardware, and Gen2 support will require more
development, move the file to arch/arm64/boot/dts/renesas/.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Link: https://lore.kernel.org/r/20211229193135.28767-2-laurent.pinchart+renesas@ideasonboard.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
The highest-performance mode for the Cortex-A57 CPU cores supported on
R-Car H3Ne (R8A779M8) is the Power Optimized (1.5 GHz) mode. The Normal
(1.6 GHz) and High Performance (1.7 GHz) modes are not supported.
Hence drop the "turbo-mode" entries from the operating points table
inherited from r8a77951.dtsi.
Fixes: 6e87525d75 ("arm64: dts: renesas: Add Renesas R8A779M8 SoC support")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/aeb4530f7fbac8329b334dcb169382c836a5f32d.1655458564.git.geert+renesas@glider.be
"make dtbs_check":
arch/arm64/boot/dts/renesas/r8a774c0-cat874.dtb: thermal-zones: cpu-thermal:thermal-sensors: [[74], [0]] is too long
arch/arm64/boot/dts/renesas/r8a774c0-ek874.dtb: thermal-zones: cpu-thermal:thermal-sensors: [[79], [0]] is too long
arch/arm64/boot/dts/renesas/r8a774c0-ek874-idk-2121wr.dtb: thermal-zones: cpu-thermal:thermal-sensors: [[82], [0]] is too long
arch/arm64/boot/dts/renesas/r8a774c0-ek874-mipi-2.1.dtb: thermal-zones: cpu-thermal:thermal-sensors: [[87], [0]] is too long
arch/arm64/boot/dts/renesas/r8a77990-ebisu.dtb: thermal-zones: cpu-thermal:thermal-sensors: [[105], [0]] is too long
From schema: Documentation/devicetree/bindings/thermal/thermal-zones.yaml
Indeed, the thermal sensors on R-Car E3 and RZ/G2E support only a single
zone, hence #thermal-sensor-cells = <0>.
Fix this by dropping the bogus zero cell from the thermal sensor
specifiers.
Fixes: 8fa7d18f9e ("arm64: dts: renesas: r8a77990: Create thermal zone to support IPA")
Fixes: 8438bfda9d ("arm64: dts: renesas: r8a774c0: Create thermal zone to support IPA")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/28b812fdd1fc3698311fac984ab8b91d3d655c1c.1655301684.git.geert+renesas@glider.be
Extracted from a bigger patch in the BSP, rebased, reg length corrected,
and DMA properties added.
Signed-off-by: Linh Phung <linh.phung.jy@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20220614095242.8264-1-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Extracted from a bigger patch in the BSP, rebased and DMA
properties added.
Signed-off-by: Linh Phung <linh.phung.jy@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20220614095109.8175-1-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
RSPI1 (SPI1) interface is available on PMOD0 connector (J1) on the
carrier board. This patch adds pinmux and spi1 nodes to the carrier
board dtsi file and drops deleting pinctl* properties from board
DTS file.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220608173025.22792-2-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Describe the clocks for the eight Cortex-A55 CPU cores.
CA55 Sub-System 0 (first 2 clusters / CPU cores 0-3) is clocked by Z0φ.
CA55 Sub-System 1 (last 2 clusters / CPU cores 4-7) is clocked by Z1φ.
For now no operating points are defined.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Link: https://lore.kernel.org/r/c502087f9affa86dd665def0d990d277a51cc75c.1654701480.git.geert+renesas@glider.be
Complete the description of the Cortex-A55 CPU cores and L3 cache
controllers on the Renesas R-Car S4-8 (R8A779F0) SoC, including CPU
topology and PSCI support for enabling CPU cores.
R-Car S4-8 has 8 Cortex-A55 cores, grouped in 4 clusters.
Based on patches in the BSP by Takeshi Kihara.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Link: https://lore.kernel.org/r/d6af5975090d5830cb053b52400439bd1cbe8fc7.1654701480.git.geert+renesas@glider.be
Describe the cache configuration for the first Cortex-A55 CPU core on
the Renesas R-Car S4-8 (R8A779F0) SoC.
Extracted from a larger patch in the BSP by LUU HOAI.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Link: https://lore.kernel.org/r/a63715ce1d2d2fcc7ab987f7a1b40847965e8d6a.1654701480.git.geert+renesas@glider.be
Fix whitespace coding style: use single space instead of tabs or
multiple spaces around '=' sign in property assignment. No functional
changes (same DTB).
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220526204231.832090-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Add support for 3 TSC nodes of thermal. The 4th node is for the control
domain and not for Linux.
Signed-off-by: Linh Phung <linh.phung.jy@renesas.com>
[wsa: rebased, fixed resource size, removed unused 4th node breaking probe]
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20220525151355.24175-1-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Numbered regulators are prone to conflicts, causing silent overwrites
(see e.g. [1]).
Make conflicts less likely to happen by renaming all numbered regulators
to names reflecting the regulator's purposes.
[1] commit 45f5d5a9e3 ("arm64: dts: renesas: r8a77995: draak: Fix
backlight regulator name").
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/b90dfeb834c4d7dabd22bf03396f33df58f54507.1652264651.git.geert+renesas@glider.be
Currently there are two nodes named "regulator_camera". This causes the
former to be overwritten by the latter.
Fix this by renaming them to unique names, using the preferred hyphen
instead of an underscore.
While at it, update the name of the audio regulator (which was added in
the same commit) to use a hyphen.
Fixes: a1d8a344f1 ("arm64: dts: renesas: Introduce r8a774a1-beacon-rzg2m-kit")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/a9ac82bdf108162487289d091c53a9b3de393f13.1652263918.git.geert+renesas@glider.be
Despite the name, R-Car V3U is the first member of the R-Car Gen4
family. Hence update the compatible properties in various device nodes
to include family-specific compatible values for R-Car Gen4 instead of
R-Car Gen3:
- DMAC,
- (H)SCIF,
- I2C,
- IPMMU,
- WDT.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/73cea9d5e1a6639422c67e4df4285042e31c9fd5.1651497071.git.geert+renesas@glider.be
The Renesas R-Car CAN-FD Controller on R-Car Gen3 and RZ/G2 SoCs has two
interrupts. Add interrupt-names properties to all CAN-FD device nodes
to identify the individual interrupts, so we can make this property a
required property in the DT bindings.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/10eef1e20372af4a156b06df8e5124666ec7c6b6.1651512451.git.geert+renesas@glider.be
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
Based on the work done by Dien Pham <dien.pham.ry@renesas.com>
and others for r8a77990 SoC.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220501112926.47024-6-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Add suffix '-clk' for can and extal clk node names and replace the
clk node names audio_clk{1,2} with audio{1,2}-clk as per the device
tree specification.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220428133156.18080-2-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Add suffix '-clk' for can and extal clk node names and replace the
clk node names audio_clk{1,2} with audio{1,2}-clk as per the device
tree specification.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220428133156.18080-1-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Endpoints node must have a remote-endpoint property, as endpoints only
exist to model a link between ports. Drop the empty rgb output endpoints
from SoC dtsi files, and declare them in the board dts instead.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Link: https://lore.kernel.org/r/20220424161228.8147-2-laurent.pinchart+renesas@ideasonboard.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Endpoints node must have a remote-endpoint property, as endpoints only
exist to model a link between ports. Drop the empty lvds endpoints from
SoC dtsi files, they should be instead declared in the board dts or in
overlays.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Link: https://lore.kernel.org/r/20220424161228.8147-1-laurent.pinchart+renesas@ideasonboard.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Enable USB2.0 Host/Device support on RZ/G2UL SMARC EVK by
adding usb{0,1} pincontrol entries to the soc-pinctrl dtsi
and deleting the nodes which disabled it.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220429072400.23729-4-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Enable Audio on RZ/G2UL SMARC EVK by adding ssi1 pincontrol entries
to the soc-pinctrl dtsi and ssi1 and cpu sound_dai nodes to the board
dtsi.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220429072400.23729-3-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
On RZ/G2{L,LC} SoM module, the wm8978 audio codec is connected to ssi0,
whereas on RZ/G2UL it is connected to ssi1. So move ssi0 and cpu
sound_dai nodes from common dtsi to board specific dtsi.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220429072400.23729-2-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Initial support for the Renesas White Hawk CPU and BreakOut boards.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220428135058.597586-4-yoshihiro.shimoda.uh@renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
