Add support for W25N01JW, W25N02JWZEIF, W25N512GW,
W25N02KWZEIR and W25N01GWZEIG.
W25N02KWZEIR has 8b/512b on-die ECC capability and other
four has 4b/512b on-die ECC capability.
Signed-off-by: Sridharan S N <quic_sridsn@quicinc.com>
Signed-off-by: Md Sadre Alam <quic_mdalam@quicinc.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20231012064134.4068621-1-quic_sridsn@quicinc.com
Winbond uses 3 bytes to identify flash: vendor_id, dev_id_0, dev_id_1,
but current driver uses only first 2 bytes of it for devices
identification. As result Winbond W25N02KV flash (id_bytes: EF, AA, 22)
is identified as W25N01GV (id_bytes: EF, AA, 21).
Fix this by adding missed identification bytes.
Signed-off-by: Mikhail Kshevetskiy <mikhail.kshevetskiy@iopsys.eu>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-1-mikhail.kshevetskiy@iopsys.eu
Currently there are 3 different variants of read_id implementation:
1. opcode only. Found in GD5FxGQ4xF.
2. opcode + 1 addr byte. Found in GD5GxGQ4xA/E
3. opcode + 1 dummy byte. Found in other currently supported chips.
Original implementation was for variant 1 and let detect function
of chips with variant 2 and 3 to ignore the first byte. This isn't
robust:
1. For chips of variant 2, if SPI master doesn't keep MOSI low
during read, chip will get a random id offset, and the entire id
buffer will shift by that offset, causing detect failure.
2. For chips of variant 1, if it happens to get a devid that equals
to manufacture id of variant 2 or 3 chips, it'll get incorrectly
detected.
This patch reworks detect procedure to address problems above. New
logic do detection for all variants separatedly, in 1-2-3 order.
Since all current detect methods do exactly the same id matching
procedure, unify them into core.c and remove detect method from
manufacture_ops.
Tested on GD5F1GQ4UAYIG and W25N01GVZEIG.
Signed-off-by: Chuanhong Guo <gch981213@gmail.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20200208074439.146296-1-gch981213@gmail.com
NAND datasheets usually give the maximum number of bad blocks per LUN
and this number can be used to help upper layers decide how much blocks
they should reserve for bad block handling.
Add a max_bad_eraseblocks_per_lun to the nand_memory_organization
struct and update the NAND_MEMORG() macro (and its users) accordingly.
We also provide a default mtd->_max_bad_blocks() implementation.
Signed-off-by: Boris Brezillon <bbrezillon@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
W25N01GV is a single die version of the already supported
W25M02GV with half the capacity. Everything else is the
same so introduce support for W25N01GV.
Datasheet:http://www.winbond.com/resource-files/w25n01gv%20revl%20050918%20unsecured.pdf
Tested on 8devices Jalapeno dev board under OpenWrt running 4.19-rc5.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add support for the W25M02GV chip.
Signed-off-by: Frieder Schrempf <frieder.schrempf@exceet.de>
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
